![]() Moreover, the solder joints experienced phase change from liquid to solid during the cooling stage of the reflow process. Results showed that the full-grid ball grid array (BGA) package has greatest temperature deviations, indicating different time responses between the start of the solidification process at different locations of the soldering process. The numerical results were found to be in agreement with the experimental results. A thermal profiling experiment was conducted using the forced convection reflow oven to validate the simulation model. In this approach, numerical techniques for computational fluid modeling of the internal flow in the reflow oven were coupled with the structural cooling modeling at the board and package levels using a multi-physics code coupling interface. ![]() The aim of this paper is to investigate temperature and thermal stress responses at various joint arrangements during the cooling stage of the reflow process using an effective numerical approach. This fact leads to the inference that the quality of the process in question may reflect in better conditions and cost competitiveness for the investigated organization. The achieved results showed that the Reflow welding process of BGA component meets the criteria for acceptance of international standards IPC -A - 610E and IPC 7095B. In the welding process of the BGA component by collecting (cross section and X-ray) and data analysis (alignment, cracks and voids) within the process. ![]() The methods and techniques used were the qualitative-quantitative approach, conducted by the case study technic This article aimed to conduct an analysis of the quality and reliability of the Reflow soldering process of component of BGA technology. In recent years many efforts have been expended by companies in the search for technological improvement of its products by adding features such as light weight, reduced size and high levels of performance at the lowest cost, to meet a worldwide demand in ![]()
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |